Voyant Photonics is redefining how machines see the world.
Our LiDAR-on-chip products enable compact, affordable, and power-efficient 3D sensing for robotics, drones, industrial automation, and beyond.
By replacing bulky, mechanical LiDARs with solid-state solutions built on integrated photonics, we’re delivering high-performance sensing at scale. With Voyant, machines can sense, understand, and navigate their environments with unprecedented precision.
As a growing company, we’re looking for engineers who want to move fast, solve hard problems, and leave their mark on a foundational technology. You’ll join a mission-driven team at the intersection of product design, silicon photonics and machine perception.
Location: San Francisco, Hybrid
Architect and develop analog and mixed-signal electronics for compact, high-performance hardware modules, using TIAs, ADCs, precision current sources, and power supplies like LDOs and switching regulators.
Own designs from concept through production, including schematic capture, component selection, and PCB layout in collaboration with layout engineers.
Ensure signal integrity, power integrity, and EMI/EMC compliance across high-speed and noise-sensitive interfaces.
Define and execute bring-up, characterization, and validation plans (e.g., DVT, EVT), with a focus on robustness, repeatability, and manufacturability.
Analyze design trade-offs (performance, cost, power, integration complexity) in the context of tightly constrained product architectures.
Partner closely with system architects, mechanical engineers, and firmware teams to ensure seamless integration and system-level reliability.
Experience: 7+ years in hands-on hardware development, with end-to-end ownership of systems that shipped at scale.
Execution: Demonstrated ability to deliver high-reliability designs under tight constraints on power, cost, form factor, and schedule.
Technical Strengths:
Deep expertise in low-noise analog and high-speed digital design.
Strong grounding in signal/power integrity, high-density interconnect, and EMI mitigation techniques.
Familiarity with high-volume design-for-manufacturing (DFM), reliability testing, and yield optimization.
Tools & Skills:
Proficient in schematic capture and simulation (e.g., SPICE), with working knowledge of Altium or similar.
Experience with SI/PI simulation tools (e.g., HyperLynx, SiWave) and measurement tools (GHz-range scopes, VNAs, spectrum analyzers).
Familiarity with board-level integration of FPGAs, microcontrollers, and custom analog ASICs.
Experience with high-speed ADCs, custom analog IC interfaces, or photonics-related electronics.
Knowledge of flex and rigid-flex PCB design.
Familiarity with Verilog-AMS or mixed-signal modeling.
Exposure to Verilog HDL or FPGA development.
Experience designing for high-reliability or harsh environments (e.g., automotive, aerospace).
Competitive base salary and a meaningful equity package.
Comprehensive health benefits (Medical, Dental, Vision).
Unlimited PTO and paid company holidays.
Team events and company meetups.
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